{"data":{"ticker":"BESIY","slug":"be-semiconductor-industries","name":"BE Semiconductor Industries","exchange":"OTC","sector":"Technology","headquarters":"Duiven, Netherlands","ceo":"Richard W. Blickman","employees":2001,"website":"https://www.besi.com","founded":"1995","layers":[{"slug":"chip-equipment","name":"Chip Equipment & Foundries"}],"exposure":{"score":68,"tier":"Strategic","rationale":"Besi leads die attach and sets the standard in hybrid bonding, the packaging step next generation HBM and chiplet AI accelerators depend on. The thesis depends on hybrid bonding adoption ramping, since today's revenue still leans on mainstream assembly markets."},"quote":{"price":167.33,"change24hPct":-2.43,"change7dPct":2.47,"change30dPct":-27.77,"change1yPct":-1.29,"high52w":368.69,"low52w":141.89,"marketCap":13237019648,"peRatio":39.65,"eps":4.22,"volume24h":370468},"nextEarningsDate":null,"summary":"BE Semiconductor Industries, known as Besi, makes the assembly equipment that packages finished semiconductor die. Chipmakers and packaging subcontractors buy its machines to attach dies to substrates, mold packages, and plate connections. The company earns revenue from equipment sales, spares, and service.","explainer":["BE Semiconductor Industries, known as Besi, makes the assembly equipment that packages finished semiconductor die. Chipmakers and packaging subcontractors buy its machines to attach dies to substrates, mold packages, and plate connections. The company earns revenue from equipment sales, spares, and service.","Besi leads the market in die attach and has become the standard setter in hybrid bonding, a technique that joins chips with direct copper connections at far finer pitch than solder allows. Hybrid bonding, developed in partnership with Applied Materials, underpins next generation HBM stacks and chiplet based AI accelerators. Packaging and plating lines round out the portfolio.","Founded in 1995 and headquartered in Duiven, Netherlands, Besi employs around 2,000 people and trades in the US as an OTC ADR under BESIY."],"buildoutRole":"Besi sits in the Chip Equipment layer, at the packaging end of the AI supply chain. As transistor scaling slows, AI chipmakers gain performance by stacking and tiling dies, which shifts the bottleneck to assembly. Besi's hybrid bonding tools enable the copper to copper stacking planned for future HBM generations and chiplet accelerators, while its die attach machines serve today's advanced packages. Its role grows as each accelerator generation adopts denser packaging, though current revenue still leans on mainstream assembly markets.","faq":[{"q":"What does BE Semiconductor Industries do?","a":"Besi makes semiconductor assembly equipment. Its machines attach finished dies to substrates, mold packages, and plate connections for chipmakers and packaging subcontractors worldwide, and it leads the market in die attach and hybrid bonding technology."},{"q":"How is BE Semiconductor Industries exposed to AI?","a":"Hybrid bonding, where Besi sets the industry standard, is the packaging technology behind next generation HBM and chiplet based AI accelerators. Supercycle rates it Strategic with an AI Exposure Score of 68 out of 100, close to the Core tier."},{"q":"What are Besi's main products?","a":"Die attach systems, hybrid bonding equipment co-developed with Applied Materials, thermocompression bonding tools, and packaging and plating lines. Hybrid bonding is the product most tied to AI, enabling fine pitch copper connections between stacked dies."},{"q":"Who leads Besi and where is it based?","a":"Richard W. Blickman serves as CEO. Founded in 1995, the company is headquartered in Duiven, Netherlands, employs around 2,000 people, and trades in the US as an OTC ADR under the ticker BESIY."},{"q":"Is BESIY a pure play AI stock?","a":"No. Supercycle rates Besi as Strategic with a score of 68. Hybrid bonding adoption is driven almost entirely by AI class packaging, but most of today's revenue comes from mainstream assembly equipment serving automotive, mobile, and computing chips."}],"history1y":[{"date":"2026-09-22","close":221.99},{"date":"2026-09-23","close":216.52},{"date":"2026-09-24","close":215.01},{"date":"2026-09-25","close":214.92},{"date":"2026-09-28","close":212.47},{"date":"2026-09-29","close":219.74},{"date":"2026-09-30","close":217.14},{"date":"2026-10-01","close":216.69},{"date":"2026-10-02","close":231.66},{"date":"2026-10-05","close":229.42},{"date":"2026-10-06","close":214.76},{"date":"2026-10-07","close":197},{"date":"2026-10-08","close":197.23},{"date":"2026-10-09","close":201},{"date":"2026-10-12","close":196.05},{"date":"2026-10-13","close":194.16},{"date":"2026-10-14","close":191.5},{"date":"2026-10-15","close":184.99},{"date":"2026-10-16","close":172.63},{"date":"2026-10-19","close":177.41},{"date":"2026-10-20","close":174.58},{"date":"2026-10-21","close":184},{"date":"2026-10-22","close":175.15},{"date":"2026-10-23","close":162.1},{"date":"2026-10-26","close":163.3},{"date":"2026-10-27","close":183.08},{"date":"2026-10-28","close":182},{"date":"2026-10-29","close":181.85},{"date":"2026-10-30","close":171.49},{"date":"2026-11-02","close":167.33}],"incomeStatements":[{"ticker":"BESIY","report_period":"2025-12-31","fiscal_period":"2025-FY","period":"annual","currency":"USD","revenue":591331000,"cost_of_revenue":217057000,"gross_profit":374274000,"operating_expense":0,"operating_income":173056000,"net_income":131641000,"earnings_per_share":1.66,"earnings_per_share_diluted":1.66,"research_and_development":80975000,"selling_general_and_administrative_expenses":120243000,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0},{"ticker":"BESIY","report_period":"2024-12-31","fiscal_period":"2024-FY","period":"annual","currency":"USD","revenue":607473000,"cost_of_revenue":211529000,"gross_profit":395944000,"operating_expense":0,"operating_income":195591000,"net_income":181992000,"earnings_per_share":2.3,"earnings_per_share_diluted":2.3,"research_and_development":74305000,"selling_general_and_administrative_expenses":126048000,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0},{"ticker":"BESIY","report_period":"2023-12-31","fiscal_period":"2023-FY","period":"annual","currency":"USD","revenue":578862000,"cost_of_revenue":203074000,"gross_profit":375788000,"operating_expense":0,"operating_income":213392000,"net_income":177084000,"earnings_per_share":2.23,"earnings_per_share_diluted":2.23,"research_and_development":56440000,"selling_general_and_administrative_expenses":105956000,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0},{"ticker":"BESIY","report_period":"2022-12-31","fiscal_period":"2022-FY","period":"annual","currency":"USD","revenue":722870000,"cost_of_revenue":279797000,"gross_profit":443073000,"operating_expense":0,"operating_income":294116000,"net_income":240647000,"earnings_per_share":2.9,"earnings_per_share_diluted":2.9,"research_and_development":53945000,"selling_general_and_administrative_expenses":95012000,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0}],"balanceSheets":[{"ticker":"BESIY","report_period":"2025-12-31","fiscal_period":"2025-FY","period":"annual","currency":"USD","total_assets":1113747000,"current_assets":856984000,"cash_and_equivalents":372986000,"total_liabilities":697350000,"current_liabilities":154325000,"total_debt":521238000,"shareholders_equity":416397000,"retained_earnings":118800000},{"ticker":"BESIY","report_period":"2024-12-31","fiscal_period":"2024-FY","period":"annual","currency":"USD","total_assets":1234476000,"current_assets":998393000,"cash_and_equivalents":342319000,"total_liabilities":733212000,"current_liabilities":166979000,"total_debt":544709000,"shareholders_equity":501264000,"retained_earnings":169998000},{"ticker":"BESIY","report_period":"2023-12-31","fiscal_period":"2023-FY","period":"annual","currency":"USD","total_assets":896553000,"current_assets":688292000,"cash_and_equivalents":188477000,"total_liabilities":475140000,"current_liabilities":137233000,"total_debt":319160000,"shareholders_equity":421413000,"retained_earnings":162779000},{"ticker":"BESIY","report_period":"2022-12-31","fiscal_period":"2022-FY","period":"annual","currency":"USD","total_assets":1135190000,"current_assets":936698000,"cash_and_equivalents":491686000,"total_liabilities":506655000,"current_liabilities":143891000,"total_debt":342885000,"shareholders_equity":628535000,"retained_earnings":219389000}],"holders13f":[],"news":[]},"meta":{"version":"v1","asOf":"2026-11-02","builtAt":"2026-11-03T05:33:49.936Z","tier":"free","source":"https://supercyclehq.com/stock/be-semiconductor-industries","disclaimer":"Informational only, not investment advice. The AI Exposure Score is Supercycle's editorial opinion. Agent portfolios are simulated paper portfolios run by AI.","license":"Free to use and quote with attribution to supercyclehq.com. Do not redistribute as a dataset."},"links":{"self":"https://supercyclehq.com/api/v1/stocks/BESIY","html":"https://supercyclehq.com/stock/be-semiconductor-industries","md":"https://supercyclehq.com/stock/be-semiconductor-industries.md","docs":"https://supercyclehq.com/api/v1/openapi.json"}}