{"data":{"ticker":"DSCSY","slug":"disco","name":"Disco","exchange":"OTC","sector":"Technology","headquarters":"Ota, Japan","ceo":"Kazuma Sekiya","employees":5547,"website":"https://www.disco.co.jp","founded":"1937","layers":[{"slug":"chip-equipment","name":"Chip Equipment & Foundries"}],"exposure":{"score":72,"tier":"Core","rationale":"Disco dominates the grinders and dicers that thin and cut wafers, steps that HBM stacking and advanced packaging for AI multiply. The thesis depends on HBM and advanced packaging volumes continuing to outgrow the broader chip cycle."},"quote":{"price":31.14,"change24hPct":1.53,"change7dPct":-0.35,"change30dPct":-21.62,"change1yPct":-7.82,"high52w":55.39,"low52w":27.35,"marketCap":33789212672,"peRatio":33.48,"eps":0.93,"volume24h":921152},"nextEarningsDate":null,"summary":"Disco Corporation makes the precision tools that grind, dice, and polish semiconductor wafers. Chipmakers and packaging houses buy its equipment to thin wafers and cut them into individual die. The company earns revenue from machines plus a steady stream of consumable blades and grinding wheels, and it holds a dominant global share in its niche.","explainer":["Disco Corporation makes the precision tools that grind, dice, and polish semiconductor wafers. Chipmakers and packaging houses buy its equipment to thin wafers and cut them into individual die. The company earns revenue from machines plus a steady stream of consumable blades and grinding wheels, and it holds a dominant global share in its niche.","Its DFG grinders thin wafers to the extreme tolerances that HBM memory stacking requires, while DAD dicing saws and DFL laser saws singulate finished wafers. Because HBM stacks a dozen or more thinned dies in a single package, AI memory production consumes far more grinding and dicing capacity than conventional chips.","Founded in 1937 and headquartered in Ota, Japan, Disco employs around 5,500 people and trades in the US as an OTC ADR under DSCSY."],"buildoutRole":"Disco sits in the Chip Equipment layer of the AI buildout. HBM memory and chiplet based accelerators depend on wafers being thinned and cut with extreme precision, and Disco's grinders and dicers are the default tools for those steps worldwide. As advanced packaging becomes the bottleneck of AI chip supply, grinding and dicing intensity per package rises. That puts Disco directly in the path of HBM and packaging capacity expansion, even though its tools also serve the broader chip market.","faq":[{"q":"What does Disco Corporation do?","a":"Disco makes precision grinding, dicing, and polishing equipment for semiconductors, along with the blades and wheels those machines consume. Chipmakers and packaging houses use its tools to thin wafers and cut them into individual chips before packaging."},{"q":"How is Disco Corporation exposed to AI?","a":"HBM memory and advanced packaged AI accelerators require far more grinding and dicing than conventional chips, and Disco holds a near monopoly in those tools. Supercycle rates it Core with an AI Exposure Score of 72 out of 100."},{"q":"What are Disco's main products?","a":"DFG grinders that thin wafers, DAD dicing saws and DFL laser saws that cut them into die, and the precision blades and grinding wheels those machines consume, which give Disco a recurring revenue stream alongside equipment sales."},{"q":"Who leads Disco and where is it based?","a":"Kazuma Sekiya serves as CEO. Founded in 1937, the company is headquartered in Ota, Japan, employs around 5,500 people, and trades in the US as an OTC ADR under the ticker DSCSY."},{"q":"Is DSCSY a pure play AI stock?","a":"No. Supercycle rates Disco as Core with a score of 72. AI related HBM and packaging work is a disproportionate driver of demand, but its equipment also grinds and cuts wafers for the entire semiconductor industry, from automotive to consumer chips."}],"history1y":[{"date":"2026-09-22","close":35.37},{"date":"2026-09-23","close":34.65},{"date":"2026-09-24","close":33.87},{"date":"2026-09-25","close":34.68},{"date":"2026-09-28","close":35.15},{"date":"2026-09-29","close":36.81},{"date":"2026-09-30","close":36.7},{"date":"2026-10-01","close":37.95},{"date":"2026-10-02","close":39.73},{"date":"2026-10-05","close":40.31},{"date":"2026-10-06","close":40.79},{"date":"2026-10-07","close":38.37},{"date":"2026-10-08","close":37.64},{"date":"2026-10-09","close":38.66},{"date":"2026-10-12","close":37.53},{"date":"2026-10-13","close":37.14},{"date":"2026-10-14","close":35.32},{"date":"2026-10-15","close":34.55},{"date":"2026-10-16","close":32.85},{"date":"2026-10-19","close":33.43},{"date":"2026-10-20","close":33.75},{"date":"2026-10-21","close":34.2},{"date":"2026-10-22","close":32.43},{"date":"2026-10-23","close":31.07},{"date":"2026-10-26","close":31.25},{"date":"2026-10-27","close":32.67},{"date":"2026-10-28","close":33.94},{"date":"2026-10-29","close":33.17},{"date":"2026-10-30","close":30.67},{"date":"2026-11-02","close":31.14}],"incomeStatements":[{"ticker":"DSCSY","report_period":"2026-12-31","fiscal_period":"2026-FY","period":"annual","currency":"USD","revenue":436889000000,"cost_of_revenue":130412000000,"gross_profit":306477000000,"operating_expense":0,"operating_income":305502000000,"net_income":135521000000,"earnings_per_share":124.984,"earnings_per_share_diluted":124.984,"research_and_development":0,"selling_general_and_administrative_expenses":0,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0},{"ticker":"DSCSY","report_period":"2025-12-31","fiscal_period":"2025-FY","period":"annual","currency":"USD","revenue":393313000000,"cost_of_revenue":115743000000,"gross_profit":277570000000,"operating_expense":0,"operating_income":277451000000,"net_income":123891000000,"earnings_per_share":113.905,"earnings_per_share_diluted":113.905,"research_and_development":0,"selling_general_and_administrative_expenses":0,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0},{"ticker":"DSCSY","report_period":"2024-12-31","fiscal_period":"2024-FY","period":"annual","currency":"USD","revenue":307554000000,"cost_of_revenue":98912000000,"gross_profit":208642000000,"operating_expense":0,"operating_income":208605000000,"net_income":84205000000,"earnings_per_share":77.426,"earnings_per_share_diluted":77.426,"research_and_development":0,"selling_general_and_administrative_expenses":0,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0},{"ticker":"DSCSY","report_period":"2023-12-31","fiscal_period":"2023-FY","period":"annual","currency":"USD","revenue":284135000000,"cost_of_revenue":99629000000,"gross_profit":184506000000,"operating_expense":0,"operating_income":184471000000,"net_income":82891000000,"earnings_per_share":76.298,"earnings_per_share_diluted":76.298,"research_and_development":0,"selling_general_and_administrative_expenses":0,"interest_expense":0,"income_tax_expense":0,"weighted_average_shares_diluted":0}],"balanceSheets":[{"ticker":"DSCSY","report_period":"2026-12-31","fiscal_period":"2026-FY","period":"annual","currency":"USD","total_assets":743410000000,"current_assets":494572000000,"cash_and_equivalents":284575000000,"total_liabilities":155286000000,"current_liabilities":154458000000,"total_debt":0,"shareholders_equity":587758000000,"retained_earnings":521924000000},{"ticker":"DSCSY","report_period":"2025-12-31","fiscal_period":"2025-FY","period":"annual","currency":"USD","total_assets":654087000000,"current_assets":424502000000,"cash_and_equivalents":229167000000,"total_liabilities":161387000000,"current_liabilities":160392000000,"total_debt":0,"shareholders_equity":492352000000,"retained_earnings":431718000000},{"ticker":"DSCSY","report_period":"2024-12-31","fiscal_period":"2024-FY","period":"annual","currency":"USD","total_assets":556058000000,"current_assets":386945000000,"cash_and_equivalents":215486000000,"total_liabilities":149501000000,"current_liabilities":148715000000,"total_debt":0,"shareholders_equity":406362000000,"retained_earnings":346293000000},{"ticker":"DSCSY","report_period":"2023-12-31","fiscal_period":"2023-FY","period":"annual","currency":"USD","total_assets":468797000000,"current_assets":305118000000,"cash_and_equivalents":163053000000,"total_liabilities":120757000000,"current_liabilities":119974000000,"total_debt":0,"shareholders_equity":347795000000,"retained_earnings":293209000000}],"holders13f":[],"news":[]},"meta":{"version":"v1","asOf":"2026-11-02","builtAt":"2026-11-03T05:33:49.876Z","tier":"free","source":"https://supercyclehq.com/stock/disco","disclaimer":"Informational only, not investment advice. The AI Exposure Score is Supercycle's editorial opinion. Agent portfolios are simulated paper portfolios run by AI.","license":"Free to use and quote with attribution to supercyclehq.com. Do not redistribute as a dataset."},"links":{"self":"https://supercyclehq.com/api/v1/stocks/DSCSY","html":"https://supercyclehq.com/stock/disco","md":"https://supercyclehq.com/stock/disco.md","docs":"https://supercyclehq.com/api/v1/openapi.json"}}