Kulicke and Soffa Industries
KLIC · NASDAQ · Technology
$83.14
+$1.24 (+1.49%) today
Market Cap
$4.35B
24h Volume
$119.6M
P/E Ratio
38.0
52w High
$133.47
52w Low
$34.87
Est. AI Revenue
15%
7-Day Sparkline (Static)
Company facts
Performance
About Kulicke and Soffa Industries
Kulicke and Soffa makes the bonding equipment that connects semiconductor die to their packages, the step that turns a bare die into a usable component. Its ball bonders and wedge bonders wire up chips across automotive, consumer, and industrial markets, and it sells the tools and spares those machines consume.
The growth story is thermocompression bonding, which stacks dies with fine pitch interconnects for HBM memory and chiplet packages. The company has placed TCB systems with leading customers as advanced packaging capacity expands for AI accelerators. Advanced dispense and electronics assembly equipment round out the portfolio.
Founded in 1951 and headquartered in Singapore, Kulicke and Soffa employs about 2,600 people and lists on NASDAQ under KLIC.
Kulicke and Soffa Industries in the AI buildout
Kulicke and Soffa sits in the Chip Equipment layer at the assembly step. Its core wire bonding business serves mainstream chips, where demand follows the broad semiconductor cycle. The AI angle runs through thermocompression bonding: stacking HBM dies and chiplets requires the fine pitch attachment its TCB systems provide, and each advanced packaging line built for AI accelerators is a potential socket. That opportunity is real but still a minority of the business, which keeps its buildout role emerging rather than central.
KLIC is tracked in Chip Equipment & Foundries, rated Growing on the AI Exposure leaderboard.
By the numbers
52-week range
KLIC trades at $83.14, 49% of the way up its 52-week range of $34.87 to $133.47.
Market cap
Market capitalization is $4.35B, with an AI Exposure Score of 35 out of 100.
Valuation vs peers
Its P/E ratio of 38.0 is in line with the Chip Equipment & Foundries category median of 44.2.
Next earnings
Kulicke and Soffa Industries is next expected to report earnings on November 18, 2026.
Market data as of the close on . Prices are end of day, not live.
Frequently asked questions
What does Kulicke and Soffa Industries do?
Kulicke and Soffa makes semiconductor assembly equipment, led by ball bonders and wedge bonders that connect chips to their packages. It also sells thermocompression bonding systems, advanced dispense equipment, and the tools and spares its machines consume.
How is Kulicke and Soffa Industries exposed to AI?
Its thermocompression bonders address HBM stacking and chiplet packaging, the assembly steps central to AI accelerators, though mainstream wire bonding still drives most revenue. Supercycle rates it Growing with an AI Exposure Score of 35 out of 100.
What are Kulicke and Soffa's main products?
Ball bonders and wedge bonders for mainstream chip assembly, thermocompression bonding systems for fine pitch die stacking, and advanced dispense equipment, plus consumable tools and spares that generate recurring revenue.
Who leads Kulicke and Soffa and where is it based?
Lester A. Wong serves as CEO. Founded in 1951, the company is headquartered in Singapore, employs about 2,600 people, and lists on NASDAQ under the ticker KLIC.
Is KLIC a pure play AI stock?
No. Supercycle rates Kulicke and Soffa in the Growing tier with a score of 35. Its TCB systems give it a genuine advanced packaging angle, but the core bonding business serves automotive, consumer, and industrial chips across the general semiconductor cycle.
Profile written 2026-08, updated as the business changes. Editorial content, not investment advice.
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